Reliability Test Machine - Company Ranking(3 companyies in total)
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Low Temperature Test / Cold Resistance Test High Temperature Test / Heat Resistance Test Temperature and Humidity Cycle Test Temperature Cycle Test Altitude Test / Decompression Test Condensation Cycle Test (Humidity and Thermal Test) Pressure Cooker Test (HAST Test) Conductor Resistance Evaluation Test Insulation Resistance Evaluation Test Vibration Test Combined Environmental Test (Temperature and Humidity + Vibration) HALT/HASS Test Salt Spray Test Salt Spray Combined Cycle Test Sand and Dust Test Chemical Resistance Test | Electrochemical migration of high-density interconnection substrates Verification of high-temperature characteristics of electronic components and small electronic devices Evaluation of whiskers associated with lead-free plating of evaluation electronic devices Evaluation of conductive adhesives and anisotropic conductive film connections Verification of temperature and humidity characteristics of large machinery (e.g., reproduction of the usage environment of export products on-site) Reproduction tests of market defects such as solder cracks and solder fractures Verification of vibration stress effects in HALT testing | ||
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エスペック
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- Featured Products
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Commissioned Testing and Calibration Certificate
- overview
- Low Temperature Test / Cold Resistance Test High Temperature Test / Heat Resistance Test Temperature and Humidity Cycle Test Temperature Cycle Test Altitude Test / Decompression Test Condensation Cycle Test (Humidity and Thermal Test) Pressure Cooker Test (HAST Test) Conductor Resistance Evaluation Test Insulation Resistance Evaluation Test Vibration Test Combined Environmental Test (Temperature and Humidity + Vibration) HALT/HASS Test Salt Spray Test Salt Spray Combined Cycle Test Sand and Dust Test Chemical Resistance Test
- Application/Performance example
- Electrochemical migration of high-density interconnection substrates Verification of high-temperature characteristics of electronic components and small electronic devices Evaluation of whiskers associated with lead-free plating of evaluation electronic devices Evaluation of conductive adhesives and anisotropic conductive film connections Verification of temperature and humidity characteristics of large machinery (e.g., reproduction of the usage environment of export products on-site) Reproduction tests of market defects such as solder cracks and solder fractures Verification of vibration stress effects in HALT testing
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エスペック
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